In the SMD production process, COB eliminates surface plating, patch, reflow welding and other production processes, reducing the process by one-third, thereby improving quality.
Compared with SMD product assembly, COB removes the lamp holder, and the display module is thinner and lighter.
COB surface is modular level integrated package, non-lamp bead separation assembly, with anti-impact, anti-shock and anti-pressure, waterproof and dustproof, anti-smoke, static and other characteristics.
NOVOSHINE products utilize the exclusive semiconductor-level process - [3D Coating Technology], which boasts superior 3D printing technology to ensure that no melanin accumulates on the chip surface, thereby significantly reducing the blocking and polarization interference of black substances on Micro LED chips.
Thanks to the application of this innovative technology, the screen brightness of NOVOSHINE products has been improved by 300%, achieving an outstanding performance of ≥2000nit. At the same time, with the same brightness, its power consumption has been reduced by 30%, enabling a significant reduction in screen temperature and achieving more energy-efficient, long-lasting operation.
